Thermal Conductivity of Building Material Apparatus

Product Description

Description of DIDAC Thermal Conductivity of Building Material Apparatus: The Thermal Conductivity of Building Material Apparatus uses a PID controlled flat plate electrical heater and a water cooled flat plate with an integral and highly sensitive heat flowmeter. The 300mm *300mm specimen under test is sandwiched between the heated and cooled plates. The assembly is contained in a thermally insulated enclosure to minimise heat losses. The heat flowmeter gives an output to a digital panel meter on the special control and instrumentation console. Special thermocouples are arranged to measure mean temperatures either side of the test specimen, allowing the temperature gradient across the sample and hence the thermal conductivity to be determined.Experimental Capabilities of Thermal Conductivity of Building Material Apparatus: Rapid measurement of Thermal Conductivity For Materials with Thermal Resistance in the range 0.1 to 1.4 m2 K/W.(Resistance=Thickness/Conductivity) Measurement of the Thermal Resistance of typical building materials. Measurement of the Thermal Resistance of thin stacked samples of building materials. Specification of Thermal Conductivity of Building Material Apparatus: The assembly is contained in a thermally insulated enclosure to minimise heat losses. The loading system supplied ensures that the same clamping force is applied to all specimens. The heat flowmeter gives an output to a digital panel meter on the special control and instrumentation console. Special thermocouples are arranged to measure mean temperatures either side of the test specimen, allowing the temperature gradient across the sample and hence the thermal conductivity to be determined. The thickness of the test sample may be measured in situ using the dial indicator on the clamping mechanism. The unit allows the thermal resistance of samples to be determined and the measurement of samples connected in series This allows the formula relating individual thermal resistances and the overall thermal resistance of a stacked sample to be investigated.